QUICK Intelligent Equipment

22/05/2025

Final Day at SEA 2025!​​ Thank you to all friends and partners for your support during the exhibition! QUICK is still here at ​​Hall D-B1601​ to welcome you. Come visit us!

21/05/2025

🌊 DAY 2! The tide is rising— is riding the wave at SEA!
📍 Find us at Hall D-B1601. Let's make this week glow. 🌟

20/05/2025

Opening Today! SEA 2025 kicks off. Welcome to at Hall D-B1601 to discuss new industry opportunities!

19/05/2025

Countdown 1 Day Left! Booth setup is in full swing.

QUICK cordially invites you to join us tomorrow at SEA 2025 to explore our packaging equipment.

Visit at Hall D-B1601!

07/05/2025

The Europe 2025 officially commenced today at Nuremberg Exhibition Centre, gathering global experts and industry leaders to explore cutting-edge advancements in power electronics, driving transformative discussions on next-generation technologies.

QUICK has made its dazzling PCIM Europe debut, presenting its self-developed packaging solutions, including multifunctional die bonder, thermo-compression die bonder, sintering equipment, formic acid soldering oven, and die packaging AOI.

16/04/2025

We are thrilled to invite you to join us at NEPCON China 2025, and the concurrent IC Packaging fair.

📅 Dates: April 22-24, 2025
🔜 Booth: 1E75 (NEPCON) & 1J28 (ICPF)
📍 Location: Shanghai World Expo Exhibition & Convention Center

We’d love to welcome you to our booth to discuss new opportunities and showcase our cutting-edge technologies and solutions. Save the date and make sure to visit us – we look forward to meeting you soon!

24/12/2024

As we wrap up another year, wish you all a Merry Christmas and a Happy New Year!
Stay safe, enjoy the holidays, and let’s move forward to inspire each other in the year ahead! 🎄🎁✨

22/12/2024

22/11/2024

La estación de soldado de está diseñada para la soldadura profesional de componentes electrónicos utilizando soldaduras sin plomo. Cuenta con un nuevo diseño de pantalla LCD y botones de fácil uso para ajustar digitalmente los parámetros necesarios. Contamos con inventario para entrega inmediata.

Conoce más e este producto en nuestro brochure, descárgalo aquí👨‍💻 https://drive.google.com/file/d/1mcjUnrMvMw-WAJYT_4NtrChBqi-UjjpO/view?usp=sharing
O visita nuestra página web:
🔗 https://smartsol.mx/
📧 Correo a [email protected]

20/11/2024

The 8th National Hand Soldering Competition was successfully held in Shanghai! Over 500 competitors from 300 companies competed together. Congratulations to the winners from Sichuan and Jiangsu for showcasing their exceptional skills! We are proud to support the contest and witness impressive performance.
Thanks to everyone who made it a success!

16/11/2024

📣 Congratulations to 🏆 Zhou Zhiheng from China for being awarded the 2024 Hand Soldering World Championship in Electronica 2024 Munich, Germany.
🎉Your exceptional skill, precision, and mastery in hand soldering have shone brightly on this global stage! 👏

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31/10/2024

2024 focuses on the development opportunities of advanced , deeply analyzes the global electronics industry trends, and promotes the transformation and upgrading of the electronics industry. With the continuous development of technologies and the expansion of their application fields, the demand for AI chips, particularly high-end , will continue to increase. Notably, the packaging of new memory chips like involves high-precision advanced techniques such as thermocompression bonding ( ) and hybrid bonding ( ). We are actively lay-outing in the field of advanced packaging high-end equipment, and focusing on technological breakthroughs for bonding equipment related to core processes in advanced packaging.