30/09/2026
**πΉ Application**
PCB dispensing and spraying processes for semiconductor manufacturing. Applies adhesives, underfill, encapsulants and protective coatings onto PCB substrates and packages through precise dispensing and uniform spray application, ensuring chip protection, insulation and long-term reliability. Widely applied in semiconductor packaging, SiP modules, IC substrates and advanced assembly lines.
**πΉ Advantages**
β
Precise dispensing and uniform spraying meet high-reliability semiconductor process requirements
β
Accurate process control protects sensitive chip areas and fine-pitch circuits
β
Stable process quality ensures consistent protection and high yield
β
Compatible with underfill, encapsulant and protective coating materials
β
Flexible switching between dispensing and spraying modes in one platform
β
Support automated high-volume continuous production