Gluditec

Gluditec We’re specialized in advanced glue and dispensing solutions for manufacturers The perfect dispensing system is always the best foundation for superior results.

GLUDITEC is a worldwide provider of high-tech specialty materials and adhesive feeding, mixing and dispensing solutions with exceptional knowledge regarding materials. Deciding on an adhesive, sealant, or potting medium is followed by selecting the dispensing system. With the development of chemical material, the dispensing system has to pace up with continuously improved technologies. Thanks to o

ur close collaboration with several material manufacturers, we are confident to bring customers the right and flexible dispensing system for any materials and applications. However, we could still ensure the balance of cost-effective, quality, and durability of the system as well as 24/7 local service. Thanks to automating the dispensing system, manufacturers could not only optimize cost and time but also increase the quality of end products. Dispensing is more than this word implies. GLUDITEC would accompany customers through projects, clarify all aspects, carry out tests, and commission the system. If necessary we could also help you optimize your systems further and ensure their efficient operation with our various service modules.

28/08/2026

Magnet bonding is not simply about holding a magnet in place.

In this video, we introduce 3 adhesives for magnet bonding that can withstand the demands of the operating environment while supporting an efficient assembly process.

What makes the right adhesive in Industrial Manufacturing? Contact us to receive in-depth technical advice!

Watch the below video to better understand the critical role of having the right underfill solution and materials 👇.If y...
21/08/2026

Watch the below video to better understand the critical role of having the right underfill solution and materials 👇.

If you are looking for a low viscosity, excellent flow, and reworkable epoxy underfill, Gluditec proudly introduces our ES3500: a one-component underfill designed for BGA and CSP applications.

Reinforce the connection. Strengthen assembly reliability.



Underfill is applied when electronic components require additional ...

14/08/2026

Different SMT processes require different cleaning solutions.

From stencil cleaning to reflow jigs & fixtures and PCBA cleaning, Gluditec’s water-based cleaning agents are designed for multiple cleaning needs in SMT manufacturing.

07/08/2026

A coating engineered for critical electronics.

Watch the full video to discover how UV-CC01 can provide reliable protection across critical electronics.

24/07/2026

Not every seal needs to be cut. Some are created exactly where they're needed.

Meet PUT5702 — Two-Component Polyurethane Foam-In-Place Gasket, engineered by Gluditec for automated dispensing systems and industrial enclosure sealing.

Watch the full video to discover how PUT5702 can help simplify sealing processes while supporting flexible manufacturing.

17/07/2026

Meet TIM4610K One-Part Thermal Conductive Putty - Engineered for demanding thermal management.

With 10.0 W/m·K thermal conductivity, reliable electrical insulation, and stable performance across a wide operating temperature range, TIM4610K helps improve heat transfer where performance matters most.

Contact Gluditec to receive technical advice the right thermal management solution for your application.

10/07/2026

In silicone-sensitive optical systems, every material matters.

Discover the advanced GLT-SF2 and GLT-SF3 Silicone Free Thermal Pads, specifically designed for precision electronic applications, notably camera modules, where optical cleanliness is critical.

𝗦𝘁𝗼𝗽 𝗖𝗵𝗼𝗼𝘀𝗶𝗻𝗴 𝗔𝗱𝗵𝗲𝘀𝗶𝘃𝗲𝘀. 𝗖𝗵𝗼𝗼𝘀𝗲 𝘁𝗵𝗲 𝗿𝗶𝗴𝗵𝘁 𝗠𝗮𝘁𝗲𝗿𝗶𝗮𝗹 𝗦𝘆𝘀𝘁𝗲𝗺. Episode 1: How to Protect a Type-C Connector? Ensuring precis...
03/07/2026

𝗦𝘁𝗼𝗽 𝗖𝗵𝗼𝗼𝘀𝗶𝗻𝗴 𝗔𝗱𝗵𝗲𝘀𝗶𝘃𝗲𝘀. 𝗖𝗵𝗼𝗼𝘀𝗲 𝘁𝗵𝗲 𝗿𝗶𝗴𝗵𝘁 𝗠𝗮𝘁𝗲𝗿𝗶𝗮𝗹 𝗦𝘆𝘀𝘁𝗲𝗺.

Episode 1: How to Protect a Type-C Connector?

Ensuring precise bonding and reliable protection for delicate Type-C connector pins is critical to maintain assembly quality and long-term product performance.

Thus, adhesives which are used for Type-C Connector Pin Bonding & Protecting should be specially chosen to support accurate bonding and effective protection of connector pins during electronic assembly.

Below are some recommended adhesives for Type-C Connector Pin Bonding & Protecting from our technical team:
• UV5131: Ultra-Fast Curing Speed, High Viscosity and Robust Mechanical Protection, High Weather Resistance and Eco-Friendly Composition
• UV5127: Ultra-Fast Curing Speed, High Mechanical Strength and Thermal, High Purity and Safe Composition for Electronics Resistance
• UV5102: Fast UV Curing, Robust Mechanical Protection & Anti-Short-Circuit Bending, Premium Surface Drying & Non-Sticky Finish
Since every manufacturing challenge requires a purpose-built solution, contact us for free advice for your most suitable materials.

In Low Pressure Molding, bubbles inside the molded part are a common defect — but they do not always come from one singl...
20/06/2026

In Low Pressure Molding, bubbles inside the molded part are a common defect — but they do not always come from one single cause.

Bubble formation can be related to the material, the mold design, the machine condition, or the process parameters.

1. Material Issues
Hot melt adhesives, especially polyamide-based materials, can absorb moisture if they are not stored properly. During heating, trapped moisture or volatile substances may turn into gas and create bubbles inside the molded part. Contaminated materials or excessive recycled content can also increase the risk of bubble formation.

2. Mold Design Issues
If the mold does not have proper venting, gas cannot escape during the filling process. Poor gate location or complex part geometry can also trap air inside the mold cavity, causing visible bubbles or voids in the final product.

3. Machine & Process Parameter Issues
Incorrect injection speed, pressure, holding time, mold temperature, or poor machine sealing can all affect material flow and gas release. When the process is not optimized, air may remain trapped inside the encapsulated area.

To reduce bubbles, manufacturers need to look at the full system — not just one factor.

At Gluditec, we provide a complete Low Pressure Molding solution, including:

- Mold design support
- Process parameter setup
- Material selection
- Equipment recommendation
- Application testing and optimization
- Technical support for production improvement

Whether you are developing a new application or improving an existing molding process, Gluditec can help you build a more stable, efficient, and reliable Low Pressure Molding solution.

Need support with Low Pressure Molding? Contact Gluditec today and let our team help you optimize your process from material to machine.

Address

OV3. 27 – OV3. 28, Khu Đô Thị Chức Năng Xuân Phương, Phường Xuân Phương, Quận Nam Từ Liêm
Hanoi

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