17/08/2026
Diamond Edging Wheel for Wafer Chamfering
A precise wafer edge starts with a stable chamfering process.
During wafer manufacturing, inconsistent chamfer dimensions, edge chipping, and poor profile control can affect wafer quality and downstream processing.
Our Diamond Edging Wheels for Wafer Chamfering are designed for precision edge processing of semiconductor wafers, helping achieve consistent chamfer geometry and reliable edge quality.
🔷 Suitable Materials
✔ Silicon (Si)
✔ Silicon Carbide (SiC)
✔ Sapphire
✔ GaN
✔ Other Hard & Brittle Wafer Materials
Moresuperhard can provide single groove or multi groove, integrated coarse and fine grinding wheel according to customer’s requirements.
https://www.moresuperhard.com/3/Edge_Grinding_Wheel_Silicon_Wafer_Chamfering.html
Contact us:
Email: [email protected]
WhatsApp:+8617324838957