Singulation & Dicing Blades Hongtuo Group

Singulation & Dicing Blades Hongtuo Group Founded in 1997, ZZHT is a high-tech company engaged in R&D, production, sales, and service of superabrasive tools.

Products covers vitrified, resin, metal bond super hard abrasive tools; Industry covered: automobile,semiconductor,LED,photovoltaic, etc.

"Diamond Back Grinding Wheel6-inch / 209mm specs with 6000 # grit for silicon wafer thinningFit wafer backgrinding equip...
07/08/2026

"Diamond Back Grinding Wheel
6-inch / 209mm specs with 6000 # grit for silicon wafer thinning
Fit wafer backgrinding equipment, stable ultra-fine machining performance
"

"Silicon Wafer Back Grinding Wheel‑ Long service life, supports semiconductor wafer thinning & grinding‑ Available in re...
07/08/2026

"Silicon Wafer Back Grinding Wheel
‑ Long service life, supports semiconductor wafer thinning & grinding
‑ Available in resin / vitrified bond, fits Si & SiC wafer processing
‑ 6‑inch /209mm, 6000‑grit for ultra‑fine machining
"

"Metal Chuck TableFit German and Japanese dicing saw equipmentFor wafer, electronic and optical component cuttingHigh fl...
04/08/2026

"Metal Chuck Table
Fit German and Japanese dicing saw equipment
For wafer, electronic and optical component cutting
High flatness, uniform suction force, sizes customizable
"

"Metal Bond Diamond Dicing BladeExcellent wear resistance & stable shape retentionHigh precision cutting for optical gla...
31/07/2026

"Metal Bond Diamond Dicing Blade
Excellent wear resistance & stable shape retention
High precision cutting for optical glass, quartz, BGA & electronic parts
Matches all mainstream semiconductor dicing saws, factory direct supply
"

17/04/2026

The final day of the Expo Electronica 2026.
Thanks to all visitors,and looking forward to future cooperation!

We sincerely invite you to visit CCMT 2026 in Shanghai, China!
16/04/2026

We sincerely invite you to visit CCMT 2026 in Shanghai, China!

15/04/2026

Expo Electronica 2026
Date: April 14–16, 2026
Location: Crocus Expo, Moscow C6157, Hall 14, Pavilion 3

Main products:dicing blades, ceramic vacuum chucks, thinning grinding wheels, and semi-automatic dicing saw machine

14/04/2026

Expo Electronica 2026
We warmly welcome you to visit our booth.
Date: April 14–16, 2026
Booth: C6157, Hall 14, Pavilion 3, Crocus Expo, Moscow

Christmas is around the corner! 🎄 Wishing our partners and friends a season filled with joy, warmth, and smooth business...
22/12/2025

Christmas is around the corner! 🎄 Wishing our partners and friends a season filled with joy, warmth, and smooth business deals ahead.

Address

NO. 135, Longfeinan Street, International Logistics Park, Economic Development Zone
Zhengzhou
450016

Alerts

Be the first to know and let us send you an email when Singulation & Dicing Blades Hongtuo Group posts news and promotions. Your email address will not be used for any other purpose, and you can unsubscribe at any time.

Contact The Business

Send a message to Singulation & Dicing Blades Hongtuo Group:

Shortcuts

Share